By Topic

A Multimetal Surface Micromachining Process for Tunable RF MEMS Passives

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Yonghyun Shim ; Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA ; Zhengzheng Wu ; Mina Rais-Zadeh

This paper reports on a microfabrication technology for implementing high-performance passive components suitable for advanced RF front-ends. This technology offers three metal layers with different thicknesses, one dielectric, and two sacrificial layers, enabling the fabrication of continuously tuned capacitors, capacitive and ohmic switches, as well as high- inductors all on a single chip. To demonstrate the versatility of this technology, several passive components are fabricated on a Borosilicate glass substrate . A high- tunable capacitor is fabricated exhibiting an electrostatic tuning range of more than 6 : 1. The temperature variation of capacitance from 223 to 333 K is less than 9%, and the tuning speed is better than 80 . To achieve a higher zero-bias capacitance, a tunable capacitor bank is also implemented, which can be tuned from 2.2 pF to 6.1 pF. In addition, a coupled inductor pair with self-inductances of 15 and 21 nH is implemented showing s exceeding 40 at 800 MHz. Measurements are compared with high frequency structure simulator (HFSS) electromagnetic simulations, showing good agreement. The technology reported is post-CMOS compatible and low cost.

Published in:

Journal of Microelectromechanical Systems  (Volume:21 ,  Issue: 4 )