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Use of ducting to improve inlet air conditions for side-to-side airflow switches in data centers

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2 Author(s)
Fleming, J. ; Panduit, Burr Ridge, IL, USA ; Narasimhan, S.

Switches deployed in data centers often utilize side-to-side airflow cooling. This airflow pattern can cause heated exhaust air to flow to the inlet of adjacent equipment in open rack installations or re-circulate to the switch inlet in cabinet applications. Through the use of CFD and testing, ducting solutions have been developed that improve inlet air conditions for both open rack and cabinet applications. Additionally, the ducting solutions make the side-to-side airflow switches compatible with hot aisle/cold aisle layouts as well as air containment solutions.

Published in:

Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE

Date of Conference:

18-22 March 2012

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