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Thermal analysis of 3D integrated circuits based on discontinuous Galerkin finite element method

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3 Author(s)
Zjajo, A. ; Circuits & Syst. Group, Delft Univ. of Technol., Delft, Netherlands ; van der Meijs, N. ; van Leuken, R.

Even though vertical 3D integration offers increased device density, reduced signal delay, and design flexibility, heat and thermal concerns are, nevertheless, aggravated. In this context, accurate computation of temperature profile is required to establish thermal design rules governing the feasibility of integration options. Within this framework, a novel methodology based on discontinuous Galerkin finite element method for accurate thermal profile estimation of 3D integrated circuits is proposed. The method is utilized to simulate geometrically complicated physical structures with limited complexity overhead.

Published in:

Quality Electronic Design (ISQED), 2012 13th International Symposium on

Date of Conference:

19-21 March 2012