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Fatigue Reliability Analysis of Sn–Ag–Cu Solder Joints Subject to Thermal Cycling

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2 Author(s)
F. X. Che ; School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore ; John H. L. Pang

In this paper, thermal cycling tests and finite-element analysis (FEA) for a plastic ball grid array package with Sn-3.8Ag-0.7Cu lead-free solder joints have been performed. The solder joint fatigue lives were predicted and compared by using different 2-D and 3-D FEA models. The effects of solder constitutive models and fatigue life models on solder fatigue life prediction have been investigated. In order to obtain fatigue parameters, new averaging volumes were proposed for the solder fatigue life prediction. Different reference temperatures were simulated to investigate its effect on the solder fatigue life prediction. The effect of intermetallic compound thickness on solder joint fatigue life prediction was also investigated.

Published in:

IEEE Transactions on Device and Materials Reliability  (Volume:13 ,  Issue: 1 )