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Extraction of transceiver die pin capacitance using S-parameter de-embedding technique with distributed circuit modeling

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3 Author(s)
Lai Lip Chyuan ; Altera Corporation (M) Sdn Bhd, Plot 6, Bayan Lepas Technoplex, Medan Bayan Lepas, 11900, Penang, Malaysia ; Low Hoon Ngik ; Hong Shi

This paper discusses the characterization of bare die transceivers capacitance using return loss measurement from Vector Network Analyzer. The die transceivers capacitance is extracted from the return loss measurement using de-embedding techniques with distributed circuit modeling. An equivalent distributed circuit of the transceiver was modeled and the simulation results of the model were compared with the extracted measurement results. The die pin capacitance was then extracted based on measurements and simulated results.

Published in:

Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th

Date of Conference:

7-9 Dec. 2011