By Topic

Extraction of transceiver die pin capacitance using S-parameter de-embedding technique with distributed circuit modeling

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Lai Lip Chyuan ; Altera Corp. (M) Sdn Bhd, Medan Bayan Lepas, Malaysia ; Low Hoon Ngik ; Hong Shi

This paper discusses the characterization of bare die transceivers capacitance using return loss measurement from Vector Network Analyzer. The die transceivers capacitance is extracted from the return loss measurement using de-embedding techniques with distributed circuit modeling. An equivalent distributed circuit of the transceiver was modeled and the simulation results of the model were compared with the extracted measurement results. The die pin capacitance was then extracted based on measurements and simulated results.

Published in:

Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th

Date of Conference:

7-9 Dec. 2011