By Topic

New circuit model for modeling differential pair of through-hole vias in multilayered electronic packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Zaw Zaw Oo ; Electronics and Photonics Department, Institute of High Performance Computing, A*STAR 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632 ; En-Xiao Liu ; Er-Ping Li

A new equivalent circuit model is presented for modeling a differential pair of through-hole vias in multilayered electronic packages. The differential pair of through-hole vias, which share same anti-pad clearance, is analyzed and an equivalent circuit model for the differential vias is analytically derived from the electro- and magneto-quasi-static relations of the E and H fields along with the intrinsic via circuit model. The proposed circuit model is numerically validated and integrated to a systematic analysis of microwave network approach for power and signal integrity simulation in multilayered electronic packages.

Published in:

Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th

Date of Conference:

7-9 Dec. 2011