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Efficient MPIE approach for the analysis of three-dimensional microstrip structures in layered media

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2 Author(s)
Bunger, R. ; Microwave Dept., Bremen Univ., Germany ; Arndt, F.

A full-wave space-domain method is presented for the rigorous and fast investigation of printed circuit structures of arbitrary shape on uniaxial anisotropic layered substrates including three dimensional (3-D) metallizations. The electromagnetic (EM) fields are described in terms of a mixed-potential-integral-equation (MPIE) formulation, Two different techniques-the matrix pencil (MP) technique and a cross-sectional eigenvalue (CSEV) approach-are employed to extract the S-parameters of the circuit under consideration. The usage of a triangular mesh allows the convenient modeling of arbitrarily shaped structures. Therefore, the main advantage of this method is its generality, which allows a large variety of printed circuit structures to be characterized. The flexibility of the method is demonstrated for the example of spiral inductors including air-bridges with finite-metallization thickness

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Microwave Theory and Techniques, IEEE Transactions on  (Volume:45 ,  Issue: 8 )