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Cost-effective multichip module manufacture using passive substrate fault tolerance

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3 Author(s)
Peacock, C. ; Eng. Res. & Dev. Centre, Hertfordshire Univ., Hatfield, UK ; Bolouri, H. ; Habiger, C.

The widespread use of multichip module (MCM) technology is currently restricted by high substrate cost, poor substrate yield and low quality level of mounted components: the known good die (KGD) problem. This paper examines three yield enhancing fault tolerance techniques suitable for use with conventional (passive) substrates with the aid of a generic processor-memory MCM architecture. The use of spare memory dies and a paged address space is shown to be a very effective solution to the KGD problem for this particular architecture

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:20 ,  Issue: 3 )