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The interactions during wetting between an electroless Ni-Cu-P deposit and molten InSn solders were investigated with the aid of scanning electron microscope (SEM), X-ray diffractometer (XRD), and Auger electron spectroscope (AES). The intermetallics In3Ni 2 and In27Ni10 were formed at the interlayer for the Ni-Cu-P with 51In-49Sn and 80In-20Sn systems, in the temperature range of 250-300°C. In addition to these two intermetallic compounds Ni3Sn4 was also formed with the 20In-80Sn system. The Ni3Sn4 dissipates gradually with increasing temperature. A two-stage wetting mechanism was disclosed for the wetting of Ni-Cu-P deposit with the InSn solders in the temperature range of 250-325°C
Published in:
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
(Volume:20
,
Issue:
3
)
Date of Publication: Aug 1997
- Page(s):
- 211 - 216
- ISSN :
- 1070-9894
- INSPEC Accession Number:
- 5673467
- Digital Object Identifier :
- 10.1109/96.618218
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Aug 1997
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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