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Micromachined semi-encapsulated spiral inductors for microelectromechanical systems (MEMS) applications

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5 Author(s)
Sadler, D.J. ; Dept. of Electr. & Comput. Eng. & Comput. Sci., Cincinnati Univ., OH, USA ; Wenjin Zhang ; Ahn, Chong H. ; Hi Jung Kim
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Semi-encapsulated spiral inductors for microelectromechanical systems (MEMS) applications have been designed, fabricated, and characterized using micromachining and electroplating techniques. The inductors are fabricated on a Pyrex glass wafer using a simple three mask process and have an area of 4 mm by 4 mm. Devices consist of electroplated copper conductor lines with width 50 μm, thickness 25 μm, and spacing 30 μm; they are semi-encapsulated with an electroplated Ni-Fe (81%/19%) magnetic core. At the low frequency of 10 kHz, the inductance of the devices was measured as 1.5 μH, while they exhibited a low resistance of only 3 ohms. Their low resistance and reasonably high inductance makes them ideal in MEMS applications as either sensors or actuators

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Magnetics, IEEE Transactions on  (Volume:33 ,  Issue: 5 )