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Use of flat miniature heat pipes for the thermal management of electronic packages

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3 Author(s)
Zaghdoudi, M.C. ; Unite de Rech. Mater., Mesures et Applic. (MMA), Inst. Nat. des Sci. Appl. et de Technol., Tunis, Tunisia ; Tantolin, C. ; Sarno, C.

An experimental study is realized in order to verify the mini heat pipe concept for cooling high power dissipation electronic cards. Two kinds of card substrates are considered: alumina and FR4 epoxy, and the chip on board technology is used. Different prototypes of configurations on reporting the chip on the card are tested. The thermal measurements show that the use of heat pipes allows for significantly reduced temperature gradients and maximum chip temperature decrease.

Published in:

Microelectronics (ICM), 2011 International Conference on

Date of Conference:

19-22 Dec. 2011

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