By Topic

Use of flat miniature heat pipes for the thermal management of electronic packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Zaghdoudi, M.C. ; Unite de Rech. Mater., Mesures et Applic. (MMA), Inst. Nat. des Sci. Appl. et de Technol., Tunis, Tunisia ; Tantolin, C. ; Sarno, C.

An experimental study is realized in order to verify the mini heat pipe concept for cooling high power dissipation electronic cards. Two kinds of card substrates are considered: alumina and FR4 epoxy, and the chip on board technology is used. Different prototypes of configurations on reporting the chip on the card are tested. The thermal measurements show that the use of heat pipes allows for significantly reduced temperature gradients and maximum chip temperature decrease.

Published in:

Microelectronics (ICM), 2011 International Conference on

Date of Conference:

19-22 Dec. 2011