By Topic

A 1V 357Mb/s-throughput transferjet™ SoC with embedded transceiver and digital baseband in 90nm CMOS

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

13 Author(s)

TransferJet™, based on DSSS-UWB, is a promising standard protocol which provides users high-speed, short-range, simple-usage, low-power and robust connectivity. Since its communication distance is limited to a few centimeters, the required TX output power is small enough to meet regulatory restrictions in many countries. This paper presents the first SoC that implements PHY and Connection Layer (CNL) functionality from the TransferJet™ and ECMA-398 standards. All the RF building blocks as well as digital baseband are integrated including PHY, CNL and SDIO 3.0 device controller. A coupler and an RF BPF are the only external components required to complete a wireless system.

Published in:

Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International

Date of Conference:

19-23 Feb. 2012