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3D stacked systems with on-chip DRAM provide high speed and wide bandwidth for accessing main memory, overcoming the limitations of slow off-chip buses. Power densities and temperatures on the chip, however, increase following the performance improvement. The complex interplay between performance, energy, and temperature on 3D systems with on-chip DRAM can only be addressed using a comprehensive evaluation framework. This paper first presents such a framework for 3D multicore systems capable of running architecture-level performance simulations along with energy and thermal evaluations, including a detailed analysis of the DRAM layers. Experimental results on 16-core 3D systems running parallel applications demonstrate up to 88.5% improvement in energy delay product compared to equivalent 2D systems. We also present a memory management policy that targets applications with spatial variations in DRAM accesses and performs temperature-aware mapping of memory accesses to DRAM banks.
Date of Conference: 12-16 March 2012