By Topic

Characterization of Via Structures in Multilayer Printed Circuit Boards With an Equivalent Transmission-Line Model

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Siming Pan ; Cisco Systems, Inc., San Jose, USA ; Jun Fan

Vias are typical discontinuities for high-speed signal transmission in printed circuit boards (PCBs). This paper proposes an equivalent multiconductor transmission-line model for via structures in multilayer PCBs. The proposed model is based on the physic-based circuit model, taking into account distributed effects. Various via structures with arbitrary via number, trace connections, and via stubs can be effectively handled in the equivalent transmission-line model, which is sufficiently accurate and fast to be integrated into circuit simulators for via and link-path analysis. With the proposed model, well-known transmission-line theories can be borrowed for via modeling and characterization for signal integrity in high-speed digital circuits. The proposed model is validated with both full-wave simulations and measurements for multilayer PCBs with different via structures.

Published in:

IEEE Transactions on Electromagnetic Compatibility  (Volume:54 ,  Issue: 5 )