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Compact High-Gain mmWave Antenna for TSV-Based System-in-Package Application

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6 Author(s)
Sanming Hu ; Inst. of Microelectron., Agency for Sci., Technol. & Res. (A*STAR), Singapore, Singapore ; Yong-Zhong Xiong ; Lei Wang ; Rui Li
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This paper presents a cavity-backed slot (CBS) antenna for millimeter-wave applications. The cavity of the antenna is fully filled by polymer material. This filling makes the fabrication of a silicon CBS antenna feasible, reduces the cavity size by 76.8%, and also maintains the inherent high-gain and wide bandwidth. In addition, a through-silicon via-based architecture is proposed to integrate the 135-GHz CBS antenna with active circuits for a complete system-in-package. Results show that the proposed structure not only reduces the footprint size but also suppresses the electromagnetic interference.

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Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:2 ,  Issue: 5 )