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A QoS-Enabled On-Die Interconnect Fabric for Kilo-Node Chips

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4 Author(s)
Grot, B. ; Ecole Polytech. Fed. de Lausanne, Lausanne, Switzerland ; Hestness, J. ; Keckler, S.W. ; Mutlu, O.

To meet rapidly growing performance demands and energy constraints, future chips will likely feature thousands of on-die resources. Existing network-on-chip solutions weren't designed for scalability and will be unable to meet future interconnect demands. A hybrid network-on-chip architecture called Kilo-NoC co-optimizes topology, flow control, and quality of service to achieve significant gains in efficiency.

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Micro, IEEE  (Volume:32 ,  Issue: 3 )