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High Q Single Crystal Silicon Micromechanical Resonators With Hybrid Etching Process

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4 Author(s)
Guoqiang Wu ; Grad. Sch. of Chinese Acad. of Sci., Beijing, China ; Dehui Xu ; Bin Xiong ; Yuelin Wang

This letter presents a hybrid silicon etching-based technique for single crystal silicon micromechanical resonators fabrication. The proposed method differs from previous works by combining a front-side wet anisotropic pre-etching and a front-side DRIE dry anisotropic post-etching in micromachining micromechanical resonators. The wet etching is used to pre-etch a cavity for structure release in the substrate, while the post- dry etching is employed to fabricate and release the resonator structures simultaneously. A 4.126-MHz square plate Lamé-mode resonator has been successfully fabricated using this approach. An impressive quality factor (Q) as high as 5.34×106 is experimentally measured at a pressure of 0.06 mbar, corresponding to a frequency Q product of 2.2×1013.

Published in:

Sensors Journal, IEEE  (Volume:12 ,  Issue: 7 )

Date of Publication:

July 2012

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