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A Fully SiP Integrated V -Band Butler Matrix End-Fire Beam-Switching Transmitter Using Flip-Chip Assembled CMOS Chips on LTCC

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6 Author(s)
Che-Chung Kuo ; Dept. of the Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan ; Hsin-Chia Lu ; Po-An Lin ; Chen-Fang Tai
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In this paper, a fully system-in-package (SiP) integrated V-band Butler matrix beam-switching transmitter (TX) is presented. The CMOS chips from differential process technologies are assembled on a low-temperature co-fired ceramic (LTCC) substrate carrier by flip-chip interconnects. The vertically embedded folded monopole antenna is designed and integrated into the LTCC. The array consisting of four identical monopole antennas and a Butler matrix for beam switching is realized on the LTCC for loss reduction. Four switched main beams are measured and agree well with simulation. This beam-forming TX shows the potential of the low-cost millimeter-wave SiP with CMOS chips.

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Microwave Theory and Techniques, IEEE Transactions on  (Volume:60 ,  Issue: 5 )