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This paper presents a new method for breaking down a low-power power electronics device into its constructed parts used for reliability study of the device. The exceptional feature of this new method is to break down the device into two main parts: function elements and packaging elements. This method can help for a much better prioritizing the failures in the device, and also with having more structured reliability procedure it will be more possibility to apply it in a computer program. The advantage of this method over the existing methods is discussed and also how it can be applied for studying reliability of whole system.