Referenced Items are not available for this document.
This paper overviews substrate coupling in mixed mode and RF integrated circuits. Verification methods are reviewed with emphasis on modeling techniques for the substrate. An efficient substrate coupling simulation methodology is presented that utilizes macromodels of the circuit, substrate and package, and a design example is illustrated
Published in:
ASIC Conference and Exhibit, 1997. Proceedings., Tenth Annual IEEE International
Date of Conference: 7-10 Sep 1997
- Page(s):
- 297 - 303
- Meeting Date :
- 07 Sep 1997-10 Sep 1997
- ISSN :
- 1063-0988
- Print ISBN:
- 0-7803-4283-6
- INSPEC Accession Number:
- 5766828
- Conference Location :
- Portland, OR
- Digital Object Identifier :
- 10.1109/ASIC.1997.617025
- Product Type:
- Conference Publications
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