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Substrate coupling in mixed-mode and RF integrated circuits

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2 Author(s)
Verghese, N.K. ; Cadence Design Syst. Inc., San Jose, CA, USA ; Allstot, D.J.

This paper overviews substrate coupling in mixed mode and RF integrated circuits. Verification methods are reviewed with emphasis on modeling techniques for the substrate. An efficient substrate coupling simulation methodology is presented that utilizes macromodels of the circuit, substrate and package, and a design example is illustrated

Published in:

ASIC Conference and Exhibit, 1997. Proceedings., Tenth Annual IEEE International

Date of Conference:

7-10 Sep 1997