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A claw type of MEMS probe card for the electrical testing of micro-solder ball

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2 Author(s)
Lai, T. ; Electr. & Commun. Eng., Feng Chia Univ., Taichung, Taiwan ; Tsou, C.

This paper presents a micromachined claw probe with electroplating nickel for micro-solder ball electrical testing applications. The suspension claw structure consists of two bridges and four curved cantilevers, which have a flexible spring constant in a small region. The typical bending cantilever structure, made by nickel electroplating, had a thickness of 6.5μm, a width of 10μm and a length of 80μm. The maximum out-of-plane deflections of the fabricated 40×40 claw-probe array were approximately 50μm, under the effect of residual tensile stress. For the probing test of the micro-solder ball with diameter 200μm, the contact resistance was about 20Ω when the contact force was 6.7mN.

Published in:

Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on

Date of Conference:

Jan. 29 2012-Feb. 2 2012