Cart (Loading....) | Create Account
Close category search window
 

Continuous size-selective separation using three dimensional flow realized by multilayer PDMS structure

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Yoon, D.H. ; Major in Nanosci. & Nanoengineering, Waseda Univ., Tokyo, Japan ; Sekiguchi, T. ; Go, J.S. ; Shoji, S.

This paper proposes a high accuracy fabrication method for multilayer PDMS (polydimethylsiloxane) devices. Based on newly developed multi-stacking process using three-dimensional (3D) alignment marks of the concave-convex pair structures, a multilayer PDMS device was fabricated without skillful handling for alignment. Total misalignment of smaller than 10 μm is achieved for fabrication of a five-layer PDMS device. The precisely aligned multilayer structure was applied to a novel type of particle separation. By 3D secondary rotation flow in the 3D fluidic microchannel, two types of microparticles of 10 μm and 20 μm in diameter were successfully separated with high throughput.

Published in:

Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on

Date of Conference:

Jan. 29 2012-Feb. 2 2012

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.