Referenced Items are not available for this document.
This paper reports a novel method to deliver and assemble standard 01005 format (0.016” × 0.008”, 0.4 mm × 0.2 mm) monolithic ceramic capacitors and thin-film resistors into through-wafer trenches, with a batch assembly process that can guarantee 100% assembly. This process is CMOS compatible and is competitive with capacitors and resistors fabricated through standard foundry processes.
Published in:
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Date of Conference: Jan. 29 2012-Feb. 2 2012
- Page(s):
- 373 - 376
- ISSN :
- 1084-6999
- Print ISBN:
- 978-1-4673-0324-8
- INSPEC Accession Number:
- 12618008
- Conference Location :
- Paris
- Digital Object Identifier :
- 10.1109/MEMSYS.2012.6170161
- Product Type:
- Conference Publications
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