By Topic

Wafer-level high density integration of surface mount technology components in through-silicon trenches

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Ji Hao Hoo ; Univ. of Washington, Seattle, WA, USA ; Kwang Soon Park ; Varel, C. ; Baskaran, R.
more authors

This paper reports a novel method to deliver and assemble standard 01005 format (0.016” × 0.008”, 0.4 mm × 0.2 mm) monolithic ceramic capacitors and thin-film resistors into through-wafer trenches, with a batch assembly process that can guarantee 100% assembly. This process is CMOS compatible and is competitive with capacitors and resistors fabricated through standard foundry processes.

Published in:

Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on

Date of Conference:

Jan. 29 2012-Feb. 2 2012