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High yield packaging for high-density multi-channel chip integration on flexible parylene substrate

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3 Author(s)
Chang, J.H. ; California Inst. of Technol., Pasadena, CA, USA ; Dongyang Kang ; Yu-Chong Tai

This paper reports a new chip packaging technique for the assembly of retinal prosthesis device. Here, a photoresist is used as glue to attach a chip to the targeted parylene-C substrate so that 94% of the chip area is used as attachment to prevent delamination. As a validation, chips with 268 connections were used to assess the connection yield. The results show that this new technique, combined with an additional parylene-C coating, provide a high connection yield (>;90%) and is a promising method for high-lead-count implant devices.

Published in:

Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on

Date of Conference:

Jan. 29 2012-Feb. 2 2012