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Thermal conductivity manipulation in single crystal silicon via lithographycally defined phononic crystals

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8 Author(s)
Bongsang Kim ; Sandia Nat. Labs., Albuquerque, NM, USA ; Nguyen, J. ; Clews, P.J. ; Reinke, C.M.
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The thermal conductivity of single crystal silicon was engineered to be as low as 32.6W/mK using lithographically defined phononic crystals (PnCs), which is only one quarter of bulk silicon thermal conductivity [1]. Specifically sub-micron through-holes were periodically patterned in 500nm-thick silicon layers effectively enhancing both coherent and incoherent phonon scattering and resulting in as large as a 37% reduction in thermal conductivity beyond the contributions of the thin-film and volume reduction effects. The demonstrated method uses conventional lithography-based technologies that are directly applicable to diverse micro/nano-scale devices, leading to potential performance improvements where heat management is important.

Published in:

Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on

Date of Conference:

Jan. 29 2012-Feb. 2 2012

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