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Electromigration investigations of aluminum alloy interconnects

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4 Author(s)
Setlik, B. ; Dept. of Phys., Rhode Island Univ., Kingston, RI, USA ; Heskett, D. ; Aubin, K. ; Briere, M.A.

Electrical measurements of test structures of Al-0.5%Cu interconnects were performed as a function of temperature and current density. We have examined 1.8 μm wide×0.85 μm thick×250 μm long straight structures and found an activation energy, Ea=0.95 eV and a current exponent, n=2.63, after correction for Joule heating

Published in:

University/Government/Industry Microelectronics Symposium, 1997., Proceedings of the Twelfth Biennial

Date of Conference:

20-23 Jul 1997