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The structure and characteristics of polyimide thin films by vapor deposition polymerization method

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6 Author(s)

In this work, polyimide thin films were fabricated by VDPM (vapor deposition polymerization method) of dry processes which makes it easy to control the film's thickness and hard to cause pollution due to volatile solvents. The structural analysis of molecular and electrical properties was tested. From FT-IR, polyimide was changed by curing through the precursor polyamic acid (PAA); 300°C is an apt cured temperature. From electrical measurement, the polyimide has a resistivity of about 3.2×1015 Ω cm at 30°C and the dielectric breakdown is about 4.61 MV/cm. From these experimental results, the application of the polyimide thin films as an insulator in semiconductor devices is suggested

Published in:

Properties and Applications of Dielectric Materials, 1997., Proceedings of the 5th International Conference on  (Volume:2 )

Date of Conference:

25 -30 May 1997