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Prospects of active cooling with integrated super-lattice based thin-film thermoelectric devices for mitigating hotspot challenges in microprocessors

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4 Author(s)
Alexandrov, B. ; Sch. of ECE, Georgia Inst. of Technol., Atlanta, GA, USA ; Sullivan, O. ; Kumar, Satish ; Mukhopadhyay, S.

Super-lattice thin-film thermoelectric coolers (TEC) are emerging as a promising technology for hot spot mitigation in microprocessors. This paper studies the prospect of on-demand cooling with advanced TECs integrated at the back of the heat spreader inside a package (integrated TEC). The thermal compact models of the chip and package with integrated TECs are developed and used for steady-state and transient temperature analysis. The control principles for TEC assisted transient cooling are presented and their impact on reducing thermal violations in microprocessors and TEC energy dissipations are discussed.

Published in:

Design Automation Conference (ASP-DAC), 2012 17th Asia and South Pacific

Date of Conference:

Jan. 30 2012-Feb. 2 2012