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Monitoring glass transition of epoxy encapsulant using thermal analysis techniques

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2 Author(s)
Chew, S. ; Inst. of Microelectron., Singapore ; Lim, E.

Glass transition temperature, better known by the acronym Tg in the electronic industry, is a frequently used parameter to depict the degree of cure of epoxy encapsulant. Tg can be measured by a variety of thermal analysis techniques and often vary as the optimised conditions differ between the different techniques. This paper investigates and reports the glass transition temperature range of a cured epoxy encapsulant using differential scanning calorimetry, thermomechanical analysis and dynamic mechanical analysis

Published in:

Semiconductor Electronics, 1996. ICSE '96. Proceedings., 1996 IEEE International Conference on

Date of Conference:

26-28 Nov 1996