By Topic

Thermal Management Challenges in Telecommunication Systems and Data Centers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Suresh V. Garimella ; Cooling Technologies Research Center, NSF IUCRC, School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA ; Lian-Tuu Yeh ; Tim Persoons

The framework for this paper is the growing concern about the worldwide increasing energy consumption of telecommunications systems and data centers, and particularly the contribution of the thermal management system. The present energy usage of these systems is discussed, as well as the relationship between cooling system design and the total cost of ownership. This paper identifies immediate and future thermal bottlenecks facing the industry, ranging from technological issues at the component and system level to more general needs involving reliability, modularity, and multidisciplinary design. Based on this enumeration, the main challenges to implementing cooling solutions are reviewed. Particular attention is paid to implementing liquid cooling, since this technology seems the most promising to addressing the key thermal bottlenecks, and improving the future sustainability of thermal management in the telecom and data center industry. Finally, an outlook is presented toward future potential challenges.

Published in:

IEEE Transactions on Components, Packaging and Manufacturing Technology  (Volume:2 ,  Issue: 8 )