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Cost-Effective Thermally-Managed 1.55- \mu{\rm m} VECSEL With Hybrid Mirror on Copper Substrate

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10 Author(s)
Zhuang Zhao ; Lab. for Photonics & Nanostruct., Center Nat. de la Rech. Sci., Marcoussis, France ; Bouchoule, S. ; Ferlazzo, L. ; Sirbu, A.
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An electroplated copper substrate was evaluated for heat dissipation in 1.55-μ.m optically pumped vertical extended cavity surface emitting lasers (OP-VECSELs). It is a cost-effective and flexible solution compared with the previously proposed chemical vapor deposition diamond substrate assembled by metallic bonding. Continuous-wave (CW) lasing operation was demonstrated from a device (with copper electroplated substrate) under optical pumping with pump spot diameter of 100 μm and a maximum output power of 260 mW at 0°C; heatsink temperature was achieved. Room-temperature CW operation with an output power of 75 mW and an external quantum efficiency of 35% was achieved in an optimized plane-concave cavity. The thermal resistance and the maximum output power of VECSEL chips assembled with bonded bulk copper and electroplated copper substrates were measured and compared. A value of ~50 K/W was estimated for both devices, and a similar rollover point was observed, which indicates that the electroplated copper solution leads to similar thermal properties as a bonded bulk copper substrate.

Published in:

Quantum Electronics, IEEE Journal of  (Volume:48 ,  Issue: 5 )

Date of Publication:

May 2012

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