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Browse Journals & Magazines > Components, Packaging and Man ...> Volume:2 Issue:8 Help

Preparation of Sn–Ag–In Solder Bumps by Electroplating of Sn–Ag and Indium in Sequence and the Effect of Indium Addition on Microstructure and Shear Strength

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3 Author(s)
Dong-Liang Wang ; State Key Lab. of Transducer Technol., Shanghai Inst. of Microsyst. & Inf. Technol., Shanghai, China ; Yuan Yuan ; Le Luo

This paper focused on the feasibility of preparing Sn-Ag-In ternary solder bumps with small size by two-step electroplating. The interfacial reaction and shear strength between three different solders (Sn2.2Ag, Sn1.8Ag9.4In, and Sn1.6Ag21.7In) and Cu under bump metallization (UBM) were investigated. After the reflow for 10 min, η Cu6(Sn,In)5 and ε Cu3(Sn,In) intermetallic compounds (IMC) were formed at the interface near the solder matrix and Cu UBM, respectively. Indium addition lowered the reflow temperature and improved the interface between solder and IMCs. The mean shear strength of Sn1.8Ag9.4In solder bump was higher than that of Sn2.2Ag and Sn1.6Ag21.7In solder bumps. After long time reflow, the mean shear strength increased.

Published in:
Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:2 ,  Issue: 8 )

Date of Publication: Aug. 2012

Page(s):
1275 - 1279
ISSN :
2156-3950
INSPEC Accession Number:
12894817
Digital Object Identifier :
10.1109/TCPMT.2012.2184110
Date of Publication :
22 February 2012
Date of Current Version :
31 July 2012
Issue Date :
Aug. 2012

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