By Topic

Upper Bound for the Bandwidth of Ultrathin Absorbers Comprising High Impedance Surfaces

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Yongqiang Pang ; Key Lab. of Adv. Ceramic Fibers & Composites, Nat. Univ. of Defense Technol., Changsha, China ; Haifeng Cheng ; Yongjiang Zhou ; Jun Wang

In this letter, the equivalent circuit method is employed to derive an upper bound for the bandwidth of ultrathin absorbers comprising high impedance surfaces. It is found that the maximum bandwidth is linearly determined by the thickness and the permeability of substrates. The proposed bound can be applied to ultrathin absorbers with frequency dispersive substrates. The mechanism of broadening bandwidth by the use of frequency dispersive substrates is discussed to provide guidelines for designing wideband ultrathin absorbers. Numerical examples are presented to illustrate the analytical results and show that the proposed upper bound can provide acceptable prediction of the maximum achievable bandwidth.

Published in:

Antennas and Wireless Propagation Letters, IEEE  (Volume:11 )