By Topic

Impact of control plan design on tool risk management: A simulation study in semiconductor manufacturing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Verjan, G.L.R. ; Dept. of Manuf. Sci. & Logistics, Ecole Nat. des Mines de St Etienne-CMP, Gardanne, France ; Dauzere-Peres, S. ; Pinaton, J.

In this paper, we analyze the impact of control plan design of defectivity inspections for tool risk management. Defectivity inspections are performed on products and can reveal the yield loss produced by contaminations or structural flaws. The risk considered in this paper concerns the exposure level of wafers on a tool between two defectivity controls. Our goal is to analyze how control plans can impact the manufacturing robustness from the point of view of wafer at risk on tools. A smart sampling strategy is considered for sampling lots to be measured. Actual data from the Rousset fab of STMicroelectronics are used. The simulation experiments are performed using the S5 Simulator developed by EMSE-CMP. Results show that not only the number and positions of controls operations have an important impact on tool risk management, but also how each control operation covers process operations.

Published in:

Simulation Conference (WSC), Proceedings of the 2011 Winter

Date of Conference:

11-14 Dec. 2011