Referenced Items are not available for this document.
This letter introduces the concept of a surface-mountable millimeter-wave radar sensor, which becomes possible by integrating the complete radar front end including the antennas into a single plastic package. The packaging concept is based on a matched coplanar wire-bond interconnect between the semiconductor die and the off-chip antenna. A 122-GHz antenna design is presented that uses an air cavity within the center die pad to improve the bandwidth-efficiency product. The antenna is designed in an array configuration to reduce the effect of surface waves. Measurements of the antenna prototype in the package, as well as a study on the influence of the package lid on the antenna performance, are given.
Published in:
Antennas and Wireless Propagation Letters, IEEE
(Volume:11
)
Date of Publication: 2012
- Page(s):
- 160 - 163
- ISSN :
- 1536-1225
- INSPEC Accession Number:
- 12615388
- Digital Object Identifier :
- 10.1109/LAWP.2012.2186783
- Product Type:
- Journals & Magazines
- Date of Publication :
- 03 February 2012
- Date of Current Version :
- 19 March 2012
- Issue Date :
- 2012
- Sponsored by :
- IEEE Antennas and Propagation Society
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