Cart (Loading....) | Create Account
Close category search window
 

Coplanar 122-GHz Antenna Array With Air Cavity Reflector for Integration in Plastic Packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Beer, S. ; Inst. fuer Hochfrequenztech. und Elektron. (IHE), Karlsruhe Inst. of Technol. (KIT), Karlsruhe, Germany ; Gulan, Heiko ; Rusch, C. ; Zwick, T.

This letter introduces the concept of a surface-mountable millimeter-wave radar sensor, which becomes possible by integrating the complete radar front end including the antennas into a single plastic package. The packaging concept is based on a matched coplanar wire-bond interconnect between the semiconductor die and the off-chip antenna. A 122-GHz antenna design is presented that uses an air cavity within the center die pad to improve the bandwidth-efficiency product. The antenna is designed in an array configuration to reduce the effect of surface waves. Measurements of the antenna prototype in the package, as well as a study on the influence of the package lid on the antenna performance, are given.

Published in:

Antennas and Wireless Propagation Letters, IEEE  (Volume:11 )

Date of Publication:

2012

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.