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Nano-silver inkjet printed interconnections through the microvias for flexible electronics

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4 Author(s)
Falat, T. ; Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland ; Felba, J. ; Moscicki, A. ; Borecki, J.

In the recent years the huge demand for miniaturized, highly functional and also more and more reliable electronic equipment is observed. The development of electronic industry strongly depends not only on the scale of electronic components miniaturization but also depends on miniaturization and kind of printed circuit boards (PCBs). Nowadays, the flexible substrates plays more and more important role in electronics. Organic flexible electronics are being developed for computer displays, radio frequency identification tags, sensors and actuators, solar cells and for much other devices. The use of polymer-based substrates, coupled with an inkjet printing technique opens up the possibility of cost-effective processing in high volumes by use of roll-to-roll processing. Double-sided circuits requires the electrically conductive interconnections between both layers. The big challenge is the manufacturing of surface layouts and vertical interconnections in flexible substrates in the same process without an involvement of other technologies. In the current paper the idea of through-hole microvias metallization by using the inkjet printing technique is presented.

Published in:

Nanotechnology (IEEE-NANO), 2011 11th IEEE Conference on

Date of Conference:

15-18 Aug. 2011

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