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Miniaturization - solder paste attributes for maximizing the print & reflow manufacturing process window

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1 Author(s)
Vijay, K. ; Indium Corp. of Eur., Milton Keynes, UK

Current technology drivers span a broad spectrum that include miniaturized hand-held devices where real estate is at a minimum as well as high density server assemblies that have high-reliability requirements. SMT (Surface Mount Technology) assembly consequently involves overcoming challenges that include- complex components such as sub-0.4mm CSPs, 01005s, LGAs; Area Ratios of 0.6 and below; Stencil apertures sub-250 microns dia, Stencil thicknesses between 75-110 microns; Solder-Mask vs Non-Solder-Mask defined pads; varied surface finishes such as OSP, ImAg; and long reflow profiles with reflow in air.

Published in:

Microelectronics and Packaging Conference (EMPC), 2011 18th European

Date of Conference:

12-15 Sept. 2011

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