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Co-firing of LTCC modules with embedded ferrite layers

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4 Author(s)
Naghib-zadeh, H. ; Fed. Inst. for Mater. Res. & Testing, Berlin, Germany ; Rabe, T. ; Toepfer, J. ; Karmazin, R.

Further miniaturization of electronic packaging calls for integration of magnetic functional components into LTCC modules. For integration of magnetic function into LTCC, low fired MnZn- and NiCuZn-ferrites which can be fully densified at the standard LTCC sintering temperature of 900°C were developed. To co-fire these ferrite tapes with dielectric tapes the sintering shrinkage and the coefficient of thermal expansion of ferrite and dielectric tapes must be matched. For each ferrite material a new LTCC dielectric material was designed. The embedded ferrite tapes into new LTCC dielectric tapes can be sufficiently densified during co-firing at 900°C without any cracking. Compared to separately sintered ferrites the permeability of embedded ferrite tapes is reduced. For embedded NiCuZn ferrites permeabilities between 230 and 570 (at 2 MHz) according to the thickness of the embedded ferrite layer were measured. For embedded MnZn ferrites a permeability of 300 was measured.

Published in:

Microelectronics and Packaging Conference (EMPC), 2011 18th European

Date of Conference:

12-15 Sept. 2011

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