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Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

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7 Author(s)
Ng, J.H.-G. ; Microsyst. Eng. Centre (MISEC), Heriot-Watt Univ., Edinburgh, UK ; Ssekitoleko, R.T. ; Flynn, D. ; Kay, R.W.
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This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.

Published in:

Microelectronics and Packaging Conference (EMPC), 2011 18th European

Date of Conference:

12-15 Sept. 2011

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