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We present planar low-profile designs of an artificial magnetic conductor (AMC) appropriate for integration of planar antennas into small form-factor devices for wireless communications applications. These novel AMC designs have a single metallization layer with no vias, and the whole system is suitable for inexpensive on-package integration for 60-GHz radio transceivers. They allow simultaneously for projecting the AMC behavior directly on the antenna metallization layer, while eliminating surface waves and obeying package design rules. We also project on the frequency band where the integrated antenna presents good impedance matching and maximum radiation gain. The integrated antenna-AMC design presented has large bandwidth, small form factor suitable for on-package integration, and 6 dBi gain for single elements making it ideal for small directive on-package arrays for 60 GHz radio applications.