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Forward prediction based on wafer sort data — A case study

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5 Author(s)
Sumikawa, N. ; Dept. of ECE, UC-Santa Barbara, Santa Barbara, CA, USA ; Drmanac, D.G. ; Wang, Li.-C. ; Winemberg, L.
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This paper studies the potential of using wafer probe tests to predict the outcome of future tests. The study is carried out using test data based on an SoC design for the automotive market. Given a set of known failing parts, there are two possible approaches to learn. First a single binary classification model can be learned to model all failing parts. We show that this approach can be effective if the failing parts are compatible in learning. Second, an individual outlier model can be learned for each failing part. We show that this approach is suitable for learning failing parts such as customer returns, where each may have a unique failing behavior. We also show that with Principal Component Analysis (PCA), a learning model can be visualized in two or three dimensional PC space, which facilitates an engineer to manually select or adjust the model.

Published in:

Test Conference (ITC), 2011 IEEE International

Date of Conference:

20-22 Sept. 2011