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Integrated Passive Device based RF circuit design for low-cost System-in-Package transceivers

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5 Author(s)
Da-Chiang Chang ; Nat. Chip Implementation Center, Nat. Appl. Res. Labs., Hsinchu, Taiwan ; Yuan-Chia Hsu ; Ta-Yeh Lin ; Juang, Y.-Z.
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This article presents and discusses the design of RF circuits using Integrated Passive Devices (IPDs) technology appropriate for the development of low-cost and high performance System-in-Package (SiP) wireless transceivers. Two examples, a 6-GHz voltage-controlled oscillator (VCO) and a 60-GHz 90° coupler are introduced to demonstrate the implementation of RF circuit design using an IPD process. Experimental results of the VCO and the 90° coupler will be presented and compared with the simulation results.

Published in:

SoC Design Conference (ISOCC), 2011 International

Date of Conference:

17-18 Nov. 2011