Cart (Loading....) | Create Account
Close category search window
 

Novel packaging technique and its application to a wet/wet differential pressure silicon sensor

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Krassow, H. ; Centro Nacional de Microelectron., CSIC, Barcelona, Spain ; Heimlich, D. ; Campabadal, F. ; Lora-Tamayo, E.

The packaging technique presented provides direct interaction between the sensing element and the physical or chemical variable to be measured as well as hermetic insulation and mechanical protection of the silicon sensor and its electrically active components. Unlike application specific packaging methods, it therefore can potentially be applied to a variety of microelectronic sensors

Published in:

Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on  (Volume:1 )

Date of Conference:

16-19 Jun 1997

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.