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Novel packaging technique and its application to a wet/wet differential pressure silicon sensor

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4 Author(s)
H. Krassow ; Centro Nacional de Microelectron., CSIC, Barcelona, Spain ; D. Heimlich ; F. Campabadal ; E. Lora-Tamayo

The packaging technique presented provides direct interaction between the sensing element and the physical or chemical variable to be measured as well as hermetic insulation and mechanical protection of the silicon sensor and its electrically active components. Unlike application specific packaging methods, it therefore can potentially be applied to a variety of microelectronic sensors

Published in:

Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on  (Volume:1 )

Date of Conference:

16-19 Jun 1997