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Temperature profiling in AlGaN/GaN HEMTs with nanocrystalline diamond heat spreading layers by Raman spectroscopy

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11 Author(s)
Anderson, T.J. ; Naval Res. Lab., Washington, DC, USA ; Tadjer, M.J. ; Hobart, K.D. ; Feygelson, T.I.
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Self-heating (reduction of drain current due to lower carrier mobility caused by increased phonon scattering at high drain fields) in high electron mobility transistors (HEMTs) has been well-documented in the literature. However, attempts to alleviate it have been limited. Heat spreading schemes have involved growth of AlGaN/GaN on single crystal [1] or CVD [2] diamond, or capping of fully-processed HEMTs using nanocrystalline diamond (NCD) [3]. All approaches have suffered from reduced HEMT performance or limited substrate size. Recently, a “diamond-before-gate” approach has been successfully demonstrated to both improve the thermal budget of the process by depositing NCD before the thermally sensitive Schottky gate, and to enable large-area diamond implementation [4]. A cross-section of such a device is shown in Figure 1.

Published in:

Semiconductor Device Research Symposium (ISDRS), 2011 International

Date of Conference:

7-9 Dec. 2011