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Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly

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5 Author(s)
Won-Chul Kim ; Nano Packaging and Interconnect Laboratory, Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Korea ; Kiwon Lee ; Ilkka J. Saarinen ; Lasse Pykari
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New solder anisotropic conductive films (ACFs) consist of a thermosetting polymer resin and fine solder balls instead of the conventional metal particles or metal-coated polymer particles. These solder balls have lower melting temperature than conventional metal conductive particles, which enable them to be melted during ultrasonic (US) bonding, and form intermetallic alloy joints with metal pads of flex on board. In this paper, excellent solder ACF joints are demonstrated using a US-bonding method for high-power and high-reliability flex-on-board (FOB) assemblies. Ultrasonically bonded solder ACF joints were characterized in terms of their electrical properties and reliability. Solder alloy bonding was achieved using two kinds of solder balls, i.e., Sn-58Bi and SAC305 (96.5Sn-3.0Ag-0.5Cu). At the same time, the acrylic ACF resin was completely cured after 5 s of US bonding. Solder alloy ACF joints show about 20% decrease in daisy-chain electrical resistance and 100% increase in the current-carrying capability compared with conventional physical-contact-based Ni ACF joints. Solder alloy ACF joints also show significantly improved reliability with stable electrical resistances up to 24 h in an unbiased autoclave test, whereas conventional Ni ACF joints show severe electrical open failures within 4 h.

Published in:

IEEE Transactions on Components, Packaging and Manufacturing Technology  (Volume:2 ,  Issue: 5 )