Skip to Main Content
The thermal fatigue endurances of lead-free (φ 500 and 1100 μm) plastic core solder ball (PCSB) ball grid array interconnections were investigated. The test assemblies were exposed to thermal cycling testing in temperature ranges of 0-100°C and -40 to +125°C. In addition, optical microscopy and scanning electron microscopy were used to characterize the interconnections. The characteristic lifetime data from this and earlier studies were contrasted with a recalibrated Engelmaier's model. After adjusting the model, feasibility was determined through test results of a partial array representing a real-use case. On the basis of this paper it was found that the recalibrated Engelmaier's model is, after adjustment, a suitable model for predicting the lifetime of PCSB assemblies.