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Lifetime Prediction of Non-Collapsible Solder Joints in LTCC/PWB Assemblies Using a Recalibrated Engelmaier's Model

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5 Author(s)
Jussi Putaala ; Microelectronics and Materials Physics Laboratories, University of Oulu, Oulu, Finland ; Olli Salmela ; Olli Nousiainen ; Tero Kangasvieri
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The thermal fatigue endurances of lead-free (φ 500 and 1100 μm) plastic core solder ball (PCSB) ball grid array interconnections were investigated. The test assemblies were exposed to thermal cycling testing in temperature ranges of 0-100°C and -40 to +125°C. In addition, optical microscopy and scanning electron microscopy were used to characterize the interconnections. The characteristic lifetime data from this and earlier studies were contrasted with a recalibrated Engelmaier's model. After adjusting the model, feasibility was determined through test results of a partial array representing a real-use case. On the basis of this paper it was found that the recalibrated Engelmaier's model is, after adjustment, a suitable model for predicting the lifetime of PCSB assemblies.

Published in:

IEEE Transactions on Components, Packaging and Manufacturing Technology  (Volume:2 ,  Issue: 6 )