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Electrical test method using high density plasmas for high-end printed circuit boards

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3 Author(s)
Oh, Se-Jin ; Department of Electrical Engineering, Hanyang University, 17 Haengdang-dong, Seongdong-gu, Seoul 133-791, South Korea ; Kim, Young-Cheol ; Chung, Chin-Wook

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.3676162 

A novel electrical test method that uses high-density plasmas, such as inductively coupled discharges, is proposed to detect open/short failures of high-end printed circuit boards (PCBs). The PCB is inserted into the plasma chamber with the top side facing the plasma sheath, and the bottom of the PCB is connected to the probe pin for the dc voltage bias and current measurements. A failure, including a latent open, can be precisely detected by biasing the dc voltage near the plasma potential due to the specific characteristics of the sheath formed on the PCB surface.

Published in:

Review of Scientific Instruments  (Volume:83 ,  Issue: 1 )