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A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits

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10 Author(s)
Harris, T.R. ; Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA ; Priyadarshi, S. ; Melamed, S. ; Ortega, C.
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A transient electrothermal simulation of a 3-D integrated circuit (3DIC) is reported that uses dynamic modeling of the thermal network and hierarchical electrothermal simulation. This is a practical alternative to full transistor electrothermal simulations that are computationally prohibitive. Simulations are compared to measurements for a token-generating asynchronous 3DIC clocking at a maximum frequency of 1 GHz. The electrical network is based on computationally efficient electrothermal macromodels of standard and custom cells. These are linked in a physically consistent manner with a detailed thermal network extracted from an OpenAccess layout file. Coupled with model-order reduction techniques, hierarchical dynamic electrothermal simulation of large 3DICs is shown to be tractable, yielding spatial and temporal selected transistor-level thermal profiles.

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Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:2 ,  Issue: 4 )