By Topic

Electronic equipment dielectric and thermal withstand capability curves for refunding analysis purposes

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Gondim, I.N. ; Fac. of Electr. Eng. - FEELT, Fed. Univ. of Uberlandia - UFU, Uberlândia, Brazil ; Tavares, C.E. ; Barbosa, J.A.F. ; Oliveira, J.C.
more authors

This paper is aimed at obtaining dielectric and thermal withstand capability curves of electronic devices in order to demonstrate the allowable voltage and current effect limits. The idea is to establish a computational procedure to compare system voltage and current disturbances with the equipment tolerance permitted values to guarantee the physical integrality of the product. To highlight the methodology, new and second hand TV, stereo, personal computer units are experimentally driven to their extreme dielectric and thermal strengths. The results are then referred as tolerance curves which are used as guidelines for the computational analysis of the consistency of a given relationship between a system occurrence and the consumer claimed damage for a specific product. The applicability of the whole process can be justified by the growing interest in the establishment of systematic procedures, based on well accepted computational simulations, yielding final reports that provide the necessary answer to the refunding process demand.

Published in:

Electrical Power Quality and Utilisation (EPQU), 2011 11th International Conference on

Date of Conference:

17-19 Oct. 2011