Close category search window
 

An adaptive router architecture for heterogeneous 3D Networks-on-Chip

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Agyeman, M.O. ; Sch. of Eng. & Comput., Glasgow Caledonian Univ., Glasgow, UK ; Ahmadinia, A.

Three dimensional Network-on-Chip (3D NoC) is becoming increasingly popular to address the on-chip communication demands of modern multi-core systems. However, architectural framework of the 3D router uses more buffer resources than conventional 2D routers. Also, homogeneous 3D NoC topologies have more TSVs which have a costly and complex manufacturing process. To improve the performance and manufacturing cost in 3D NoCs we propose adaptive router architectures for heterogeneous and homogeneous 3D NoCs which combine both the area and performance benefits of static 2D and 3D router architectures. Experimental results show that with a negligible penalty of up to 0.4% in maximum operating frequency, we achieved performance improvement of up to 34% by replacing 2D static routers with adaptive routers in heterogeneous architectures.

Published in:
NORCHIP, 2011

Date of Conference: 14-15 Nov. 2011

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.